ChipTest | BUs | Test Production
General
- Capabilities to test products in both packaged level Component form as well as die level wafer form
- Assignment of Unique Traceable Production Lot Numbers and Tracking of individual Lot test data
- On-line Monitoring of Test Yields and Analysis / Reporting of Low Yielding Engineering Lots
- Even load balancing technique is adopted to handle any sudden spike in the production volumes, than the usuals
- Fool-proof reject handling mechanism at all stages of Testing
- Controlled Test Program Release & Revision Control
- Controlled Load Boards & associated Hardware Maintenance
- Documented well established set-up verification procedures
Component Test
- Single-site & Multi-site handling capabilities
- Kelvin and True Plunge to Board Contacts available
- Soft and Hard Docking Handler Mechanisms
- Inhouse design & fabrication of Handler Contactor Interface
- On-line inspection of Visual Mechanical Parameters
Wafer Test
- Single-site & Multi-Site handling capabilities
- Offline and Online Inking capabilities
- Wafer Sort Results available in Standard Map formats
- On-line inspection of Probe & Ink Mark
